Join without melting materials! Vacuum equipment "Diffusion Bonding Device"
It is possible to join different metal materials that are difficult to weld, as well as to join complex shapes and small materials.
The "Diffusion Bonding Device" is a product that uses our unique vacuum technology to bond metal materials at the atomic level, allowing for the bonding of different materials as well. It minimizes material deformation, which is a common issue in welding, and enables multi-layer stacking, making high-precision processing and bonding of small materials possible. 【Features】 ■ Fine temperature control through programming ■ Bonding without melting the materials ■ Available for lease options *For more details, please refer to the materials. Feel free to contact us with any inquiries.
- Company：アトーテック
- Price：Other
